【摘要】 采用浆料包渗法在Cu基体Ni镀层表面渗铝,制备出了Ni2Al3金属间化合物渗层,研究了包渗温度对渗层组织、厚度、扩散系数和显微硬度的影响。结果表明:在600～900℃渗铝12h,均形成了单相Ni2Al3金属间化合物渗层。随着温度升高,Ni2Al3晶粒尺寸增大,渗层厚度和扩散系数增加,显微硬度降低。更多还原

【Abstract】 The surface of the electro-deposited nickel layer on copper substrate was aluminized by a slurry packing cementation process. Ni2Al3 intermetallic compound coating was formed on the surface of Ni plating. The effects of the aluminizing temperature on the microstructure, thickness, diffusion coefficient and microhardness in cross-section of coating were investigated. The results show that overall surfaces of Ni plating are covered with a single-phase Ni2Al3 intermetallic compound under an aluminizing temperature range of 600~900℃ for 12 h. The size of Ni2Al3 grains, the coating thickness and Al diffusion coefficient increase with the aluminizing temperature increasing, however, the microhardness decreases.更多还原