【摘要】 以纳米级、亚微米级、微米级三种粒径SiCp和微米级铜粉为原料,采用冷压烧结和热挤压方法制备出三种粒径SiCp/Cu基复合材料,分析和对比了复合材料显微组织的变化,研究了SiCp尺寸及含量对SiCp/Cu基复合材料导电性能和力学性能的影响。结果表明,不同尺寸及含量的SiCp在基体中有不同的分布形式,SiCp/Cu基复合材料具有良好的导电性能,其导电性随SiCp尺寸的增大而增高,随SiCp含量的增高而降低;其力学性能随SiCp尺寸及含量有着复杂的变化规律。更多还原

【Abstract】 Three kinds of SiCp reinforced copper(SiCp/Cu) matrix composites were fabricated by cold-pressed sintering technology and hot-extruding taking SiCp of various grit sizes(a nominal diameter of 30 nm,130 nm and 14 μm,respectively) and micron Cu powder as the raw materials.The microstructure of the composite was observed by scanning electron microscopy,the effects of SiCp size and content on the electrical and mechanical properties of various SiCp reinforced SiCp/Cu matrix composite were investigated.The results show that SiCp with different size and content is distributed in different form in the matrix,and SiCp/Cu matrix composite possesses excellent electrical conductivity and its electrical conductivity is improved with the increase of SiCp size and with the decrease of SiCp content.But its mechanical properties(such as hardness,tensile strength,elongation and wear-resistance) have the complex rule with SiCp size and content changing.更多还原