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硅基高长径比微孔列阵及其应用

Si-based Microchannel Array with High Length-to-Diameter Ratio and Its Application

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【作者】 李野向嵘王国政王新陈力付申成吴奎姜德龙端木庆铎田景全

【Author】 LI Ye,XIANG Rong,WANG Guo-zheng,WANG Xin,CHEN Li,FU Shen-cheng,WU Kui,JIANG De-long,DUANMU Qing-duo,TIAN Jing-quan(School of Science,Changchun University of Science and Technology,Changchun 130022,P.R.China)

【机构】 长春理工大学理学院长春理工大学理学院 长春130022长春130022

【摘要】 介绍了硅基高长径比微孔列阵形成的多路感应耦合等离子体刻蚀和电化学刻蚀等半导体工艺技术,给出了实验系统、原理、方法和实验结果,指出了工艺中出现的新现象和亟待解决的新问题,阐述了其在二维通道电子倍增器-微通道板中的应用。

【Abstract】 Multiplex inductively coupled plasma and electrochemical etchings were used-to-form microchannel array with a high length-to-diameter ratio on Si wafer.The experiment system,principle and method were described,and experimental results were given.Some new phenomena and new problems associated with the technology were investigated.Applications of the microchannel array in 2-dimensional electron multiplier(microchannel plates) were discussed.

  • 【分类号】TN305
  • 【被引频次】9
  • 【下载频次】179
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