【摘要】 微电子连接技术是微电子封装技术中的重要环节。根据微电子封装技术的发展历程,介绍了芯片封装技术中的引线键合技术、载带自动键合技术、倒装芯片键合技术等微电子连接技术以及微电子组装中适合自动化、大批量生产使用的波峰焊和再流焊技术的应用现状,并对其发展趋势进行了分析。同时,通过对不同体系的无铅钎料的特点进行比较,指出Sn-Ag-Cu系列钎料是目前较好的选择。微电子连接技术将向小型化、高性能并满足环保要求的方向发展。更多还原

【Abstract】 Microelectronics connecting technology plays an important role in the microelectronics packaging. From the development of the microelectronics packaging, this paper described the application of the microelectronics connecting technology such as the WB, TAB, FCB of the chips soldering technology, as well as the wave-soldering, reflow-soldering which are applied in the automatic and mass-production microelectronics assembling, and analyzed the trend of their development. Similarly compared with the characteristics of the lead-free solders of different systems, it is concluded that the series of Sn-Ag-Cu solder is the preferable option at present. Microelectronics connecting technology will trend to meet the needs of the environment, the miniaturization and the high capability.更多还原