【摘要】 用光学和电子显微镜、电子探针等分析测试手段,对ZA合金钎焊接头界面区的组织形态及其特征、Sn元素的成分分布及其反应产物等进行了研究分析。结果发现,ZA合金钎焊接头界面区中的Sn原子主要以体积扩散为主,形成了较宽的扩散区(扩散深度);界面区中的Sn和母材中的一些组元发生反应,形成新的相-αCuSn和Cu20Sn6,Sn原子的扩散和反应有利于提高钎缝和母材的结合强度以及钎焊接头的力学性能,以满足使用性能要求。更多还原

【Abstract】 Microstructure and its characteristic of ZA soldered joints,distribution of Sn elemont and reaction product of Sn in interface of ZA alloy soldered joints are studied by optical microscope,scanning electron microscope and electron probe microanalysis,reskectively.The results show that Sn mainly diffuses by volume diffusion and forms a wide diffusion zone.Sn in interface also reacts with some elements in parent metal.New phases such as α-CuSn and Cu20Sn6 are formed.The diffusion and reaction of Sn will be propitious to the bonding strengths and mechanical properties of soldered joints,which can satisfy the service performance of soldered joints.更多还原