【摘要】 以不同厚度的铜箔、镍箔作为缓解接头残余应力的中间层材料,在钎焊温度820℃,保温时间20 min的工艺参数条件下对Ti(C,N)基金属陶瓷与45钢进行了钎焊试验。结果表明,无论是采用铜箔还是镍箔,当其厚度从100μm增加到300μm时,接头三点弯曲强度上升趋势平缓;由于铜箔在钎焊过程中大量溶解,削弱了钎料与Ti(C,N)基金属陶瓷的化学相容性,降低了界面结合力,从而严重制约了接头强度的提高;使用镍箔的突出特点表现在具有较高的界面强度,与施加铜箔的钎焊接头相比强度显著提高,但其缓解接头残余应力的效果不如铜箔,在靠近钎缝的Ti(C,N)基金属陶瓷一侧易引发残余应力集中现象。更多还原

【Abstract】 The Cu foil and Ni foil with different thickness were used as the interlayer to ease the residual stress of the joint,and the brazing experiment was conducted in the case of brazing parameters which brazing temkeraure is 20 ℃ and holding time is 20 mins.The results show that the three-point bending strength increases smoothly when thickness of Cu fool or Ni fool is increased from 100 μm to 300 μm.Because Cu foil can be solved in the brazing process,which abates the chemistry consistency of brazing filler metal and Ti(C,N)based metal ceramic and reduces the cohesion of interface,the increase of the joint strength was confined.When Ni foil was used,the prominent characteristic is the higher interface strength compared to the joint brazed Cu foil,but its effect of easing the residual stress is not good,and stress concentration phenomenon is created easily on the side of Ti(C,N)based metal ceramic next to the brazing seam.更多还原