【摘要】 介绍了激光软钎焊技术的原理及特点,分析了激光软钎焊技术在高密度封装器件无铅连接中的应用优势。由于激光软钎焊技术具有局部加热、快速加热、快速冷却的特点,在高密度封装器件的无铅钎焊时,能够显著改善无铅钎料的润湿性能,细化无铅焊点的微观组织,提高无铅焊点的力学性能,因此激光软钎焊技术在高密度封装器件(如四边扁平封装器件以及球栅阵列封装器件)的无铅连接中有着广阔的应用前景。更多还原

【Abstract】 The principle and characteristics of the laser soldering technology are introduced,and the advantages for the application of laser soldering technology to join high density packaging device with lead-free solder are analyzed respectively.Because it is characterized by the locally heating as well as rapidly rising and falling in temperature of the laser soldering technology,the wetting property of lead-free solder,the microstructures of the joints soldered with lead-free solder and the mechanical properties of the joints are improved simultaneity.So it will be found a wide application in join high density packaging device(i.e.flat quad package as well as ball grid array package) with lead-free solder in the future.更多还原