【摘要】 利用数字散斑相关方法(DSCM),对COB封装结构在热循环状态下的表面热机械耦合效应进行了测量。利用CCD摄像机采集封装芯片在不同温度场中的散斑图像,对比采集到的图像,获取封装芯片在温度场作用下的面内变形。根据三角法测量技术原理,将离面位移的测量转化为面内位移的测量,从而获得了芯片受热后的翘曲形变和弹性应变分布。将实验测量与有限元模拟以及理论计算的结果进行了对比,3种结果吻合得比较好,表明了实验方法的有效性和可行性。更多还原

【Abstract】 Digital speckle correlation method(DSCM) is used to measure the thermomechanical coupling effect in COB packaging structures.The CCD camera is applied to capture the speckle patterns of CMOS chip at different temperature fields.by analyzing the speckle patterns,the in-plane deformation of the CMOS chip is obtained.Based on the trigonometrical theory,the out-plane displacement can be obtained by measuring the in-plane displacement,and then the elasticity thermal stress of the chip is evaluated when the application of the temperature field is repeated.The experiment results agree well with that of FEM simulations and the theoretical model.It is proved that DSCM can successfully be applied to the analysis of the thermomechanical coupling effect.The theoretical model is also verified by the result of FEM simulations and experimental testing.The experiment results provide a availability reference to the design of MEMS aparatus.更多还原