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弱碱性条件下紫铜化学抛光新工艺
A NEW TECHNOLOGY FOR CHEMICAL POLISHING OF COPPER IN WEAK ALKALINE SOLUTION
【摘要】 开发出了弱碱性溶液中紫铜化学抛光新工艺,确定了抛光液中的光亮剂(包括缓蚀剂和表面活性剂).经过一系列正交实验,获得了最佳工艺条件,并分析了影响抛光效果的各种因素.该工艺抛光速度快、腐蚀性低、环境污染小、成本低.
【Abstract】 A new technology for chemical polishing of copper in weak alkaline solution has been developed and a brightener(containing corrosion inhibitor and surfactant) has been found out.The process parameters have been optimized through the orthogonal trial,each influence factor has been analyzed.The new technology has advantages of fast polishing rate,low corrosion rate,less environmental pollution and low cost.
【关键词】 紫铜;
弱碱性溶液;
光亮剂;
缓蚀剂;
表面活性剂;
【Key words】 copper; weak alkaline solution; brightener; corrosion inhibitor; surfactant;
【Key words】 copper; weak alkaline solution; brightener; corrosion inhibitor; surfactant;
- 【文献出处】 腐蚀科学与防护技术 ,Corrosion Science and Protection Technology , 编辑部邮箱 ,2007年05期
- 【分类号】TG175.3
- 【被引频次】3
- 【下载频次】238