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无铅焊膏用助焊剂活性物质的研究

Study on active substance of flux for lead-free solder paste

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【作者】 李国伟雷永平夏志东史耀武张冰冰

【Author】 LI Guo-wei,LEI Yong-ping,XIA Zhi-dong,SHI Yao-wu,ZHANG Bing-bing(Laboratory of Advanced Electronic Joining Materials,Beijing University of Technology,Beijing 100022,China)

【机构】 北京工业大学材料学院先进电子连接材料试验室北京工业大学材料学院先进电子连接材料试验室 北京100022北京100022

【摘要】 选择几种常用活性剂进行铺展面积和润湿力性能测试,对效果较好的活性剂进行复合处理;采用铺展试验优化,模拟实际回流焊工艺进行性能测试,得到了一种较好的助焊剂。结果表明:当A酸、B酸和C酸的复合质量比为2:4:1,加入质量分数约0.56%的三乙醇胺时,溶液的pH值约为3.80,钎料焊后的扩展率可接近80%。由此配制的焊膏焊接性能良好,腐蚀性小,焊后残留量低,存储寿命较长。

【Abstract】 The properties of spreadability and wetting power with some active agent were tested according to the industry standard.The better active agent was chosen for compounding;the component of the flux was optimized by using spreadability experimental,and the reflow-soldering was simulated in the practice.The result shows that when the proportion by mass of organic acid A and organic acid B and organic acid C is 2:4:1,add in about 0.56% triethanolamine,the pH value of the flux is 3.80 approximately,the rate of expansion of solder after soldering is nearly 80%,the flux is good welding performance and a long storage life,and it is non-corrosive,the less corrosion of components.

【关键词】 电子技术活性剂铺展性润湿力助焊剂
【Key words】 electron technologyactivatorspreadabilitywetting powerflux
【基金】 “十一五”国家科技支撑计划重点资助项目(替代含铅材料的系列产品开发及产业化);北京市属高等学校人才强教计划资助项目;北京市教育委员会资助项目(2002KJ020)
  • 【文献出处】 电子元件与材料 ,Electronic Components and Materials , 编辑部邮箱 ,2007年12期
  • 【分类号】TN604
  • 【被引频次】20
  • 【下载频次】576
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