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无铅焊膏用助焊剂活性物质的研究
Study on active substance of flux for lead-free solder paste
【摘要】 选择几种常用活性剂进行铺展面积和润湿力性能测试,对效果较好的活性剂进行复合处理;采用铺展试验优化,模拟实际回流焊工艺进行性能测试,得到了一种较好的助焊剂。结果表明:当A酸、B酸和C酸的复合质量比为2:4:1,加入质量分数约0.56%的三乙醇胺时,溶液的pH值约为3.80,钎料焊后的扩展率可接近80%。由此配制的焊膏焊接性能良好,腐蚀性小,焊后残留量低,存储寿命较长。
【Abstract】 The properties of spreadability and wetting power with some active agent were tested according to the industry standard.The better active agent was chosen for compounding;the component of the flux was optimized by using spreadability experimental,and the reflow-soldering was simulated in the practice.The result shows that when the proportion by mass of organic acid A and organic acid B and organic acid C is 2:4:1,add in about 0.56% triethanolamine,the pH value of the flux is 3.80 approximately,the rate of expansion of solder after soldering is nearly 80%,the flux is good welding performance and a long storage life,and it is non-corrosive,the less corrosion of components.
【Key words】 electron technology; activator; spreadability; wetting power; flux;
- 【文献出处】 电子元件与材料 ,Electronic Components and Materials , 编辑部邮箱 ,2007年12期
- 【分类号】TN604
- 【被引频次】20
- 【下载频次】576