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压延铜箔电镀Zn-Ni合金工艺研究

Study on Zinc-Nickel Alloy Electroplating Process of Wrought Rolled Copper Foil

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【作者】 余德超谈定生郭海亮韩月香赵为上王勇范君良

【Author】 YU De-chao1,TAN Ding-sheng1,GUO Hai-liang1,HAN Yue-xiang1,ZHAO Wei-shang1,WANG Yong2,FAN Jun-liang2(1.School of Material Science and Engineering,Shanghai University,Shanghai 200072,China;2.Shanghai Jingbao Copper Foil Co.Ltd,Shanghai 200434,China)

【机构】 上海大学材料科学与工程学院上海晶宝铜箔有限公司上海晶宝铜箔有限公司 上海200072上海200072上海200434

【摘要】 研究了硫酸盐-柠檬酸体系电镀锌-镍合金工艺。该锌-镍合金作为印制板用压延铜箔的阻挡层。考察了镀液主要成分及工艺条件对压延铜箔性能的影响,并对各因素进行分析,由此确定了压延铜箔电镀锌-镍合金工艺条件。经测试,使用该工艺处理的压延铜箔与印制板基板具有良好的结合力,并具有较强的耐腐蚀性。

【Abstract】 A new process of zinc-nickel alloy plating in system of sulfate and citric acid was studied.The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.The influences of the main components of the plating bath and the technical parameters on the performances of the rolled copper foil were researched.And thus the zinc-nickel plating technical conditions were defined.The rolled copper foil treated by the process was tested.The results show that the corrosion resistance of and the adhesion between the treated rolled copper foil and the substrate are improved.

【基金】 上海市教委科研基金资助项目(2006AZ004)
  • 【文献出处】 电镀与精饰 ,Plating & Finishing , 编辑部邮箱 ,2007年06期
  • 【分类号】TQ153.2
  • 【被引频次】5
  • 【下载频次】315
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