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YL12/Cu/0Cr18Ni9Ti异种材料扩散连接接头微观分析
Microstructural Characterization of the YL12/Cu/0Cr18Ni9Ti Diffusion Bonded Joint
【摘要】 选取纯铜箔作过渡层,采用真空热压扩散工艺,在加热温度480~500℃、压力10MPa、真空度1.0×10-2Pa工艺条件下,制备了变形铝合金LY12和不锈钢0Cr18Ni9Ti双金属复合材料。利用扫描电子显微镜(SEM)、电子探针(EPMA)、X射线衍射(XRD)、显微硬度(HV)等测试分析方法对双金属复合材料的两个连接界面及基体进行组织及性能分析。结果表明:不锈钢—纯铜界面形成了宽为1.5μm的互扩散区,但其过渡区无金属间化合物生成;铝/铜界面生成了宽约35μm的扩散过渡区,过渡区的相组成为金属间化合物Al4Cu9,Al2Cu。
【Abstract】 Wrough aluminium alloy LY12 and 0Cr18Ni9Ti stainless-steel discs were joined at 480~500℃,10 MPa and 1.0×10-2pa by solid state diffusion bonding,making use of Cu foil acting as thermal stress relief interlayer.The microstructure of the two interfaces thus formed,that is,YL12/Cu and Cu/0Cr18Ni9Ti was investigated by a variety of characterization techniques such as SEM,EPMA,XRD and Vickers microhardness.The results showed that non intermetallic compound were detected within Cu/0Cr18Ni9Ti interface;adjacent to the YL 12/Cu interface a 35μm-thick layer were found to obtain Al4Cu9 and Al2Cu.
【Key words】 diffusion bonding; wrough aluminium alloy; stainless steel; interface;
- 【文献出处】 稀有金属材料与工程 ,Rare Metal Materials and Engineering , 编辑部邮箱 ,2007年S3期
- 【分类号】TG115
- 【被引频次】7
- 【下载频次】214