【摘要】 以平均粒径10 μm高纯 Si 颗粒为增强体,以 Al-Si20为基体,采用挤压铸造专利技术制备体积分数为65%的高体积分数环保型 Sip/Al-Si20复合材料。试验结果表明:复合材料的铸态组织均匀、致密,没有明显的颗粒团聚和偏聚,也不存在微小的孔洞和明显的缺陷;Sip/Al-Si20是轻质（密度为2.4 g/cm³）、低膨胀(7.77×10^-6/℃)、高导热（156.34 W/m·℃）复合材料,电导率为4.08 MS/m,具有较高的比模量和比强度,可以对其进行镀 Ni 和封装焊接,能较好的满足电子封装和热控器件的使用要求。更多还原

【Abstract】 The environment protection Sip/Al-Si20 composite,with high purity silicon of large content （65%） and particle size of 10 μm,are fabricated by squeeze-casting method.The results show that the composite are dense and Si particles distributed uniformly.No holes and obvious defects are observed.The Sip/Al-Si20 composite has low density （2.4 g/cm³）,low CTE (7.77×10^-6/℃),high thermal conductivity （156.34 W/m℃） and an electronic conductivity of 4.08 MS/m as well as higher special modulus and special strength.The Sip/Al-Si20 composite also can plate nickel and weld packaging,which can meet the application demands of electronic package and thermal management apparatus.更多还原