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硅基铁电微声学器件中薄膜残余应力的研究
Residual Stresses in Thin Films of Silicon-based Ferroelectric Micro-acoustic Devices
【摘要】 采用基底曲率法测量了硅基铁电微声学器件中各层薄膜的残余应力情况,通过调节热氧化的二氧化硅层的厚度,优化了微声学器件中复合膜的残余应力,得到平整的振膜结构,提高了器件的可靠性和成品率。
【Abstract】 The residual stresses in thin films of silicon-based ferroelectric micro-acoustic devices were measured by substrate curvature method. By adjusting the thickness of thermal silicon oxide layer, the residual stresses of the multilayer membrane structure are minimized and a flat thin multilayer membrane has been achieved, which enhances reliability and yield of the micro-acoustic devices.
【关键词】 残余应力;
基底曲率法;
微声学器件;
铁电;
【Key words】 residual stress; substrate curvature method; micro-acoustic device; ferroelectrics;
【Key words】 residual stress; substrate curvature method; micro-acoustic device; ferroelectrics;
- 【文献出处】 中国机械工程 ,China Mechanical Engineering(中国机械工程) , 编辑部邮箱 ,2005年14期
- 【分类号】TB43
- 【被引频次】7
- 【下载频次】189