【摘要】 对真空条件下制备的Sn2.0Ag0.7CuRE钎料合金显微组织、力学及物理性能进行了研究。结果表明:当稀土(RE)的添加量小于0.1%(质量分数)时,RE均匀地分布在钎料合金中,除铺展面积和延伸率与Sn37Pb钎料相当外,Sn2.0Ag0.7CuRE钎料合金的拉伸强度和导电性能均高于传统的Sn37Pb钎料;当RE添加量达到0.5%时,钎料合金中出现了明显的梅花状和点状RE化合相且弥散分布于晶界和相界附近,且拉伸强度、延伸率和铺展面积都出现了不同程度的下降。从综合性能和制造成本考虑,真空条件下制备Sn2.0Ag0.7CuRE钎料合金,RE的添加量应不大于0.1%。更多还原

【Abstract】 A new type of lead-free solder alloy Sn2.0Ag0.7CuRE was fabricated under vacuum condition. The microstructure and properties of the material, such as tensile strength, elongation, melting range, conductance and spreading area were investigated. Result shows that when the content of RE≤0.1%(mass fraction), RE distributes uniformly in the solder alloy, and the tensile strength and conductance of Sn2.0Ag0.7CuRE solder alloy are better than those of traditional Sn37Pb solder. Its elongation and spreading area are almost equal to those of Sn37Pb solder. When the content of RE reaches 0.5%, RE compounds can be easily found around the boundaries of grains and phases, and the tensile strength and elongation and spreading area of Sn2.0Ag0.7CuRE solder alloy all decrease sharply. Therefore, RE amount added to the Sn2.0Ag0.7CuRE solder alloy under 0.1% is proper.更多还原