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无压烧结制备高致密度AlN-BN复合陶瓷

Fabrication of High Density AIN-BN Composite Ceramics by Presureless Sintering

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【作者】 秦明礼曲选辉段柏华徐征宙郭世柏

【Author】 QIN Ming-Li, QU Xuan-Hui, DUAN Bo-Hua, XU Zheng-Zhou, GUO Shi-Bo( School of Materials Science and Engineering, University of Science and Technology Begijing, Beijing 100083, China; The State Key Laboratory for Powder Metallurgy, Central South University, Changsha 410083. China)

【机构】 北京科技大学材料科学与工程学院中南大学粉末冶金国家重点实验室北京科技大学材料科学与工程学院 北京 100083北京 100083长沙 410083北京 100083

【摘要】 以低温燃烧合成前驱物制备的比表面积为17.4m2/g的AIN粉末和市售BN粉末为原料,利用无压烧结工艺制备AlN-15BN复合陶瓷,研究了复合陶瓷的烧结行为以及制备材料的性能,结果表明:由于AlN粉末的烧结活性好,复合材料的烧结致密化温度主要集中在1500-1650℃之间,在1650℃烧结后,AlN-15BN复合陶瓷的相对密度可达95.6%。继续升高烧结温度,材料的致密度变化不大,热导率继续增加.在1850℃烧结3h后,可以制备出相对密度为96.1%,热导率为132.6W·m-1·K-1,硬度为HRA64.2的AIN-15BN复合陶瓷.提出了高比表面积的AlN粉末促进复合陶瓷烧结的机理,利用XRD,SEM等手段对烧结体进行了表征.

【Abstract】 AlN-BN composite ceramics were produced by pressureless sintering process with BN powders bought from market and AlN powders having a specific surface area of 17.4m2/g synthesized from a combustion precursor, as starting materials. The sintering behavior and characterization of AlN-BN composite ceramics were studied. The results showed that the sintering temperature for densification was from 1500 to 1650℃ because of the high sintering activity of AlN powders. AlN-15BN composite ceramics with relative density 95.6% were fabricated by sintering at 1650℃. The thermal conductivity of the composite ceramics was increased, while the density remained almost constant as sintering temperature increased. AlN-15BN composite ceramics with relative density 96.1%, thermal conductivity 132.6W·m-1·K-1, and HRA hardness 64.2 were produced by sintering at 1850℃ for 3h. The mechanism that high specific surface area AlN powders promoting the densification of AlN-BN composite ceramics was suggested, and the ?characterizations of the sintered bodies were determined by XRD, SEM and so on.

【关键词】 AlN-BN陶瓷密度热导率硬度
【Key words】 AIN-BN ceramicsdensitythermal conductivityhardness
【基金】 国家杰出青年基金(50025412)国家重点基础研究发展规划(G2000067203)
  • 【文献出处】 无机材料学报 ,Journal of Inorganic Materials , 编辑部邮箱 ,2005年01期
  • 【分类号】TQ174
  • 【被引频次】22
  • 【下载频次】604
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