【摘要】 以大片刨花板含水率、厚度和密度等指标作为考察因素,通过试验,观察各因素对大片刨花板的比热及导热系数的影响,分析各个参数的变化规律。所得结论对于实际生产中的热压环节具有指导意义。更多还原

【Abstract】 This research is aimed to investigate the impaction on s pecific heat and conductive coefficient of the wafer board during the hot-pressing process.The related factors such as moisture content,target thickness and target density are observed and studied during the experiment.The results are deeply studied and analyzed,the impaction of each factor is revealed afterwards.The conclusion given by this study will have a great significant on the production practice.更多还原