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多元无铅软钎料的计算机优化设计
Optimal design of multi-element lead-free soft solder with computer
【摘要】 利用二次回归正交设计法得到27组试验钎料配方,分别测定了它们的液相线温度和润湿性;选取液相线温度和润湿性的试验数据作为参数,依据回归设计理论,通过计算机辅助设计,建立了钎料的液相线温度、润湿性与Bi、Sb、Ag、Cu、Re之间关系的二次回归方程;根据最优化原理,通过建立数学模型和计算机优化运算,得到了Sn-Bi-Sb-Ag-Cu-Re系优化钎料.试验结果表明,Sn-Bi-Sb-Ag-Cu-Re系优化钎料的熔化温度和润湿性均比较好.
【Abstract】 27 prescriptions of experimental solders are fixed through quadratic regressive orthogonal design.Their liquid phase line temperature and wettability are measured separately.Choosing the experimental data of liquid phase line temperature and wettability as parameters,the quadratic regression equations on five alloying elements(Bi,Sb,Ag,Cu,Re) and performance are determined through computer-aided design.According to optimization theory and through establishing mathematics model and utilizing computer program,the optimum solder composed of Sn-Bi-Sb-Ag-Cu-Re is attained.The experimental results show that melting temperature and wettability of the optimum solder are better.
【Key words】 lead-free solder; optimization design; wettability; melting temperature; orthogonal regression;
- 【文献出处】 沈阳工业大学学报 ,Journal of Shenyang University of Technology , 编辑部邮箱 ,2005年06期
- 【分类号】TG4251
- 【被引频次】1
- 【下载频次】48