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合金元素对Sn-Bi-Sb-Ag-Cu-Re系无铅钎料性能和组织的影响
Effect of alloying elements on properties and microstructure of Sn-Bi-Sb-Ag-Cu-Re lead-free solder
【摘要】 研究了合金元素Bi、Sb、Ag、Cu、Re对锡基无铅多元钎料性能和组织的影响.研究结果表明,增加Bi、Ag、Cu含量可以降低液相线温度,Sb可以提高液相线温度;Bi、Cu有提高润湿性能的作用,Sb、Ag、Re在低含量范围内可提高润湿性能;Cu有提高剪切强度的作用,Bi明显使剪切强度降低.钎料的相组成是由在-βSn的基体上分布着金属间化合物Ag3Sn、SnBi和Cu6Sn5构成的,Sb和Re则基本上是固溶在基体中.
【Abstract】 The effect of Bi?Sb?Ag?Cu and Re on the properties and microstructure of Sn-Bi-Sb-Ag-Cu-Re lead-free solder is studied.The results of experiment show that in the studied composition range,Bi?Ag and Cu can decrease melting temperature with an increase in their content,Sb can increase melting temperature;Bi and Cu can increase the wettability,low content of Sb?Ag and Re can increase the wettability;Cu can (increase) the shear strength,Bi can decrease the shear strength obviously.Such intermetalic compounds as SnBi?Ag3Sn and Cu6Sn5 were found in the lead-free solders while Sb and Re were dissolve into Sn base.
【Key words】 lead-free solder; alloying element; melting temperature; wettability; shear strength; (microstructure);
- 【文献出处】 沈阳工业大学学报 ,Journal of Shenyang University of Technology , 编辑部邮箱 ,2005年04期
- 【分类号】TG425
- 【被引频次】6
- 【下载频次】213