【摘要】 采用挤压注塑法制备BN/N y lon1010复合电子基板材料,研究了不同BN纤维填充量的复合基板材料的微观组织结构和复合电子基板材料的介电性能及导热性能。结果表明,当BN纤维体积含量小于40%时,BN纤维基本上以孤岛形式分布在N y lon1010基体上;当BN纤维体积含量大于40%时,BN纤维开始形成连续网络。复合基板的介电常数随着BN纤维含量的增加而线性增加,介质损耗则随着BN纤维含量的增加而线性降低,复合基板的热导率随BN纤维的加入量增加而增大,但起初变化较小。当BN纤维体积含量大于40%时,热导率开始迅速增加。更多还原

【Abstract】 BN/Nylon1010 composite substrate is fabricated by the injection mold.The morphologies,the dielectric performance and thermal conductivity of composite substrate are studies.Results demonstrate that BN fibers are surround by the Nylon polymer when BN fiber volume percentage is lower than 40%.However,the BN fibers form the interconnect net when the BN fiber percentage is more than 40%.The dielectric constant of the composite substrate is linearly increasing with the increasing of BN percentage,but the dielectric loss of the composite is linearly decreasing with the increasing of BN percentage initially,and then the rate slows down.The thermal conductivity of the composite is linearly increasing with the increasing of the BN percentage and it increases sharply when the BN fibers percentage is more than 40%.It corresponds to the morphologies of the composite substrate.更多还原