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SiO2添加量对XH-11胶线膨胀系数的影响
Effect of silica addition on linear expansion coefficient of XH-11 structural adhesive
【摘要】 研究了经硅烷偶联剂处理的市售SiO2粉添加量对XH11环氧胶线膨胀系数的影响,结果表明,所添加的SiO2粉填料与胶粘剂的配比达0.75时,在剪切强度与无填料的接头相当情况下,其线膨胀系数降低了约1/3,对于降低接头中的温差热应力有明显的作用。
【Abstract】 The linear expansion coefficient of the epoxy adhesive modified with SiO2 powder filler was studied. The results showed that the expansion coefficient of the structural epoxy adhesive XH-11 decreased about 1/3 when the loading fraction of the silane-treated filler reached 0.75(filler/adhesive) when the shear strength still kept its level. The decreasing of the expansion coefficient is useful for eliminating the inner stress caused by temperature difference.
【关键词】 无机填料;
硅烷;
环氧胶;
线膨胀系数;
【Key words】 inorganic filler; silane; epoxy structural adhesive; linear expansion coefficient;
【Key words】 inorganic filler; silane; epoxy structural adhesive; linear expansion coefficient;
【基金】 湖北省教育厅2003年度科研计划重大项目(编号:2003Z0001)
- 【文献出处】 粘接 ,Adhesion In China , 编辑部邮箱 ,2005年03期
- 【分类号】TQ433.437
- 【被引频次】5
- 【下载频次】145