【摘要】 介绍了SDB/SOI(Silicon D irect Bonging/Silicon On Insulator)硅材料顶层硅膜均匀性的控制方法。顶层硅膜均匀性控制不好,会直接影响到IC或者其他元器件参数的一致性,造成器件成品率低,材料浪费大。因此,在制备SOI材料时,必须严格控制材料顶层硅厚度的均匀性和重复性。更多还原

【Abstract】 Method to control the uniformity of top silicon surface of SDB/SOI (Silicon Direct Bonging / Silicon On Insulator) is described.A nonuniform top silicon surface will have a bad effect on the parameter consistency of IC’s or other active devices,decreasing device yield and wasting SOI wafers.Therefore,it is necessary to strictly control the uniformity of the top silicon surface,as well as its repetitiveness,when preparing SDB/SOI wafers.更多还原