【摘要】 对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装(CSP)进行了研究,描述了CSP的工艺流程;详细讨论了CSP的几项主要关键技术结构设计技术,凸点制作技术,包封技术和测试技术;阐述了采用电镀和丝网漏印制备焊料凸点的方法。更多还原

【Abstract】 Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described. Key technologies for CSP, such as structure designing, solder bumping, enveloping, and testing, are discussed in particular. Techniques of electroplating and stencil printing to prepare solder bumping are also described.更多还原