【摘要】 混合集成电路“单向泄漏”问题是微电子工业中新近发现的问题,它通常出现在各种金属与玻璃封接的器件当中;然而,对于这些器件,很难发现“单向泄漏”问题的存在。文章通过对器件的密封性测试结果和内部水汽含量测试结果进行对比分析,引出器件的“单向泄漏”问题;从原理上对这种现象的产生进行了分析,介绍了有效的密封检漏方法,并提出了对这个问题的改善办法。更多还原

【Abstract】 In recent years, the hybrid microelectronics industry has been plagued with a phenomenon or condition called "one-way-leaker" on various styles of hermetically sealed glass-to-metal packages, and it is very hard to find out "one-way-leaker" on these hybrid devices.In this paper, results from both seal test and internal vapor content test are analyzed and compared, which educes the problem of "one-way-leaker".The origin of the phenomena is investigated, and an effective technique for seal test is described.Finally,a remedy to this problem is proposed.更多还原