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氮化硅干法刻蚀工艺设备模型的试验与测量
An Experiment on Process Equipment Model for Si3N4 Dry Etching
【摘要】 通过对氮化硅薄膜干法刻蚀工艺实验结果的测量,得到硅片表面非均匀性分布的具体测 量数据,并对这种现象的成因进行了定性的理论分析,为下一步建立刻蚀工艺设备模型准备了充足 的实验数据。
【Abstract】 An experiment is conducted on dry etching in Si3N4, in which the non-uniformity profile on the wafer surface is measured. Results from the measurement are analyzed qualitatively for the cause of non-uniformity profile. It provides all data needed for setting up an etching equipment model.
【关键词】 干法刻蚀;
氮化硅刻蚀;
半导体工艺;
工艺设备模型;
【Key words】 Dry etch; Si3N4 etching; Semiconductor process; Process equipment model;
【Key words】 Dry etch; Si3N4 etching; Semiconductor process; Process equipment model;
- 【文献出处】 微电子学 ,Microelectronics , 编辑部邮箱 ,2005年01期
- 【分类号】TN305
- 【被引频次】6
- 【下载频次】515