【摘要】 试验确定粉状酚醛树脂竹大片刨花板的较佳制板工艺条件为:板材密度压缩比1∶1.4(密度为0.86 g/cm3),施胶量3.5%,刨花含水率12%,热压温度(165±5)℃,闭合速度12.5 mm/s,热压时间1.35~1.45 min/mm板厚,压力8.75 MPa。按以上工艺条件制备的板材性能达到或超过加拿大CAN 3—O437.0—M85相关要求。更多还原

【Abstract】 A series of experiments on determination of manufacturing technology for bamboo-based waferboard bonded with powdered phenol-formaldehyde (PF) resin were conducted by the authors. The optimum parameters obtained though the experiments were as follows: mat compression ratio at 1∶1.4 (board density 0.86 g/cm~3 ), glue consumption of 3.5%, wafer moisture content 12% after resin application, and hot pressing at (165±5)℃ and 8.75 MPa, with closing speed at 12.5 mm/s, and pressing time at 1.35～1.45 min/mm. Waferboard made under the above conditions have excellent properties equal or even superior to the requirements of Canadian Standard CAN 3—O437.0—M85.更多还原