【摘要】 介绍了一种电子封装超声引线键合过程实时测量瞬态温度特性的实验方法,并通过实验研究了超声引线键合过程在分辨率为1ms、分析范围为40ms内的瞬态温度分布,给出了静压力和超声振幅对超声键合过程瞬态温度特性的影响,为引线键合过程的瞬态摩擦学特征估计、工艺参数优化和引线键合过程的在线质量检测提供了技术依据。更多还原

【Abstract】 An experiment method for the real-time measurement of transient temperature property during ultrasonic wire bonding process in electronic packaging is introduced. Transient temperature distribution was investigated in 40 ms with a time resolution of 1 ms. The effect of the static compressive force and the ultrasonic vibration amplitude on transient temperature property were given. The experiment results provide support for estimating transient tribological probity, optimizing technical parameters and in-situ detecting bonding quality in the ultrasonic wire bonding process.更多还原