【摘要】 无铅焊接与封装是对新一代电子产品的基本要求,SnAgCu系合金是最有可能替代SnPb焊料的无铅焊料。SnAgCu-Cu界面金属间化合物(intermetalliccomponents,IMC)的形成与生长对电子产品的性能和可靠性有重要影响。文中讨论SnAgCu-Cu界面IMC的形貌及组织演变,介绍SnAgCu-Cu界面IMC的形成、生长机理和表征方法,分析IMC对SnAgCu-Cu界面破坏行为的影响。更多还原

【Abstract】 Pb-free soldering is a basic requirement for new generation electronic packages. The Sn-Ag-Cu serials solders are widely recommended, by researches and electronic manufacturers, to be used as the substitutes of SnPb solder. However, the formation and growth of the intermetallic components (IMC) at the interface of SnAgCu solder and the Cu substrate are proven to exhibit a significant effect on the bounding strength and failure behavior of the joints. The morphological characteristics and the microstructure evolution of the IMCs were presented, the mechanism and the characterization of the IMCs as well as their influence on interface failure were also analyzed.更多还原