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FePt/Cu多层膜化降低L1₀-FePt有序化温度

LOWERING OF ORDERING TEMPERATURE FOR L1₀-FePt IN FePt/Cu MULTILAYERS

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【Author】 LI Baohe,HWANG Pol,YANG Tao,FENG Chun,TENG Jiao,ZHU Fengwu Department of Material Physics and Chemistry,University of Science and Technology Beijing,Beijing 100083 Department of Mathematics and Physics,Beijing Technology and Business University,Beijing 100037 Department of Physics,Kim Il Sung University,Pyongyang,The Democratic People’s Republic of Korea

【机构】北京科技大学材料物理与化学系；北京科技大学材料物理与化学系北京 100083 北京工商大学数理部；北京 100037；北京 100083 金日成综合大学物理系；平壤；朝鲜；北京 100083；北京 100083；

【摘要】采用直流磁控溅射方法制备FePt/Cu多层膜,再经不同温度下真空热处理得到有序L10-(FePt)100-xCux薄膜.结果表明,Cu的添加可以降低FePt薄膜有序化温度.[FePt(4nm)/Cu(0.2nm)]10多层膜在350℃热处理1h后,有序度增至0.6,矫顽力达到421kA/m.对插入极薄Cu层促进有序化在较低的温度下进行的热力学和动力学因素进行了讨论.更多还原

【Abstract】 FePt/Cu multilayers and FePt thin films were prepared by DC magnetron sputtering. The as-prepared samples were annealed in vacuum at a temperature range of 300-550℃ for 1 h. It is found that the addition of Cu could reduce the ordering temperature of FePt. The ordering parameter S was evaluated to be 0.6, and the coercivity reached 421 kA/m in [FePt(4 nm)/Cu(0.2 nm)]10 multilayers annealed at 350℃. The Cu layer induced reduction of ordering temperature is ascribed to both kinetic and thermodynamic factors.更多还原