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连接参数对Bi系(BSCCO)超导带材扩散连接接头性能的影响
Effects of Diffusion Bonding Parameters on Joints Properties of BSCCO Superconducting Tapes
【摘要】 采用高温直接加压退火工艺扩散连接61芯B i系高温超导带材。研究了835℃连接温度下接头搭接长度、搭接区窗口的台阶数、保温时间对接头结合界面特征及其超导电性的影响。结果表明,连接参数对接头超导电性Ic影响明显,超导电性低的接头其超导芯结合界面处有未焊合迹象,母材经过835℃扩散连接热循环后超导电性显著降低。
【Abstract】 Bi-Sr-Ca-Cu-O superconducting tapes with 61 cores were joined using diffusion bonding methods with uniaxial press at 835℃.The effects of bonding parameters such as window lapping length,steps of the window and high temperature holding time on the morphology and superconducting properties of the joints have been investigated.The mentioned parameters significantly influence the morphology and critical superconducting current I_c.The joints with bad superconducting properties are corresponded with no-bond interface.The I_c of the superconducting tapes is debased after thermal cycle at 835℃.
【Key words】 Bi-Sr-Ca-Cu-O(BSCCO) high temperature superconducting tapes; diffusion bonding; critical superconducting current I_c;
- 【文献出处】 金属热处理 ,Heat Treatment of Metals , 编辑部邮箱 ,2005年12期
- 【分类号】TM26
- 【被引频次】1
- 【下载频次】141