【摘要】 在集成电路芯片的现有精确热模型的基础上,提出一种简化的近似模型,与原模型相比,该近似模型的计算复杂度大大降低.提出了基于该模型的集成电路芯片热分布约束布局优化算法.用该近似模型来计算各热源的温度值和对其他热源的温度贡献值,然后用叠加原理计算出VLSI芯片上各点的温度值.热分布优化算法以芯片的平均温度和芯片面积作为优化目标,用模拟退火方法求解.实验结果表明,在考虑热约束的布局结果中,芯片上各点的温度分布均匀,最热点的温度显著降低,而芯片面积的增加却很少.更多还原

【Abstract】 A simplified thermal model is presented based on an accurate model. The approach is fast than the original one. It was applied to calculate the temperature of each heat source and its contributions to other sources. The superposition principle is applied. The optimization objective is to minimize chip’s area as well as to make the thermal distribution as evenly as possible. The simulated annealing was employed in our algorithm. The experimental results show that the thermal distributed evenly and the temperature of the “hot spots” decreased greatly in the chip.更多还原