【摘要】 为探讨热力学计算在无铅焊料的设计与研究领域中的应用,依据局部平衡理论,通过 热力学相图计算,采用商业计算软件Thermo-Calc进行了计算与模拟工作．预测出250℃焊接温度 下Sn-Ag共晶焊料与Cu基板界面处金属间化合物的形成序列;根据Scheil—Gulliver模型模拟了剩 余液态钎料非平衡凝固过程,对相演变信息进行了预测．综合计算模拟结果,确定焊接接头的组织 是由Cu6Sn5、Cu3Sn、Ag3Sn和富Sn相(BCT—Sn)组成,有效地预测了界面反应行为,与实验结果吻 合较好．更多还原

【Abstract】 In order to examine the applied potential of thermodynamic calculation in the field of designing and studying on Lead free solders, we did some calculation and simulation work by using Thermo-Calc software. According to the local equlibria theory, through calculating metastable equilibria between Cu substrate and the liquid Sn-Ag solder, the compounds forming sequences has been predicted; we simulated the Liquid solder solidification process in accordance with Scheil-Gulliver model and predicted the phases transformation information during cooling. It can be concluded that the final joint microstructure consists of Cu6Sn5 Cu3Sn Ag3Sn and Sn-rich phase (BCT-Sn), which is consistent with the previous experimental results.更多还原