【摘要】 面向芯片封装领域对高速高精度平台的需求,提出一种新型平面并联定位机构。基于复数向量表示法,建立了机构的运动学模型;结合固定界面子结构模态综合法与有限单元法,考虑连杆柔性和关节柔性,对机构建立了弹性动力学模型;通过仿真与实验的对比分析,验证了这种动力学分析方法的有效性。更多还原

【Abstract】 A new planar parallel positioning mechanism is presented, which can be used as the high-speed and high-precision table in the chip-packaging application. The kinematic model is first studied using the vector theory. Then by combining the fixed-interface mode synthesis of substructure coupling with finite element analysis, the kineto-elastodynamic model is built in consideration of the flexibility of the links and the joints. The simulations and the experiments are conducted, and the results validate the dynamic analysis method.更多还原