【摘要】 散热是影响大功率LED正常工作及器件寿命的关键因素,本文利用有限元法(FEM)对W级倒装大功率白光LED的空间温度场分布进行了模拟计算,结果与用自制的测试装置测量的温度分布相吻合。在此基础上,保持电流密度不变,研究芯片尺寸与结区温度的关系,计算出在当前的发光效率和封装结构条件下,由于散热条件的限制,芯片能承受的最大功率和能达到的最大尺寸。更多还原

【Abstract】 Heat dissipation is a key issue in the application of high-power LEDs,as it has significant influence on the output power and lifetime of the device.In this work,finite element method(FEM) is adopted to determine the temperature distribution in 1 W high-power white LEDs.The simulation results show good agreement with the experimental data.The thermal limit of the available package is also studied.The influence of chip-size on the junction temperature has been studied.The maximum input power and chip-size under certain design requirement are also given.This method offers great ease in estimating the temperature distribution and thermal limits of the package.更多还原