【摘要】 建立了叠层无氧铜微通道热沉的散热模型,通过理论计算和近似分析,优化了微通道热沉的结构参数;在t=200μm, ωc=60μm, ωf=100μm,p=2. 02×106 Pa时,可获得最小热沉热阻Rthm =4. 205×10-3 K·cm2 /W。根据优化结果,考虑微通道取向对液压降的影响,设计了一种新型大功率半导体激光器叠阵用五层结构叠层无氧铜微通道热沉,并结合实际工艺制备了无氧铜微通道热沉。在实际工作中,优化结果往往要跟实际工艺相结合,如优化所得的水压降为 2 02×106 Pa,这在实际工艺中较难实现。但在热沉实际工作的水压降条件下,热阻为 4. 982×10-3 K·cm2 /W,它能满足高功率激光器叠阵的需要。更多还原

【Abstract】 Heat dissipation model of stacks oxygen-free copper microchannel heat sink was established in this paper. Structural parameters of microchannel heat sink were optimized through theoretical calculations and approximate analysis. Minimum thermal impedance of microchannel heat sink R_thm=4.205×10^-3 K·cm²/W can be obtained when t=200 μm,ω_c=60 μm,ω_f=100 μm, p=2.2×10⁶ Pa. A new kind of five layers oxygen-free copper microchannel heat sink was designed for high power semiconductor laser stacks according to optimized results and influence of hydraulic pressure drop induced by tropism of microchannel. We fabricated the oxygen-free copper microchannel heat sink based on practical technology. The drop of water pressure of （2.02×10⁶ Pa） is not easy to realize in practice. Thermal impedance of 4.982×10^-3 K·cm²/W can fit the need of high power semiconductor laser stacks under the actual drop of operation water pressure.更多还原