【摘要】 为了研究温度、应力对PCB的可靠性的影响,根据实验条件,对某一航天PCB进行有限元模拟分析。得到了PCB的温度、变形、热应力与应变的分布情况,与实验结果很接近。表明有限元在PCB的可靠性的研究中是一种可靠的方法和计算过程中边界条件的正确性。更多还原

【Abstract】 In order to study the influence of temperature and stress on reliability of PCB, according to experiment condition, finite element simulation analysis was employed in a spaceflight PCB. The distribution of temperature, deformation, thermal stress and strain of PCB were obtained and were close to the result acquired from experiment. The result shows finite element analysis is a reliability method in study PCB reliability and the boundary condition in calculation process is right.更多还原