【摘要】 采用扫描电镜(SEM)研究了表面贴装技术制程工艺,包括锡膏黏度、锡膏模板厚度、传送带速度、恒温区保温时间、印刷电路板烘烤处理等对Sn-37Pb/Cu焊接界面层的影响。结果显示,SMT制程工艺并不影响焊接界面金属间化合物层的组成,IMCs主要成分为Cu6Sn5 相,但影响了IMCs层的形态与厚度,其中传送带速度影响了Cu6Sn5 相的平均直径,而恒温区保温时间则对IMCs层的形态与厚度影响最大。更多还原

【Abstract】 The effects of the surface mount technology （SMT） processing technology, including the solder paste viscosity,stencil thickness,conveyer speed,isothermal time,PCB roasting treatment,on the interface between Sn-37Pb solder and Cu pad of PCB were investigated with scanning electron microscope （SEM）.The results show that SMT processing technology did not affect the Cu₆Sn₅ phase in intermetallic compounds （IMCs） layer between Sn-37Pb solder and Cu pad.However, the shape and thickness of IMC layer were changed by SMT processing technology,especially the conveyer speed and isothermal time.更多还原