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SMT制程工艺对Sn-37Pb/Cu焊接界面影响
Effect of SMT Processing Technology on the Interface Between Sn-37Pb Solder and Cu pad of PCB
【摘要】 采用扫描电镜(SEM)研究了表面贴装技术制程工艺,包括锡膏黏度、锡膏模板厚度、传送带速度、恒温区保温时间、印刷电路板烘烤处理等对Sn-37Pb/Cu焊接界面层的影响。结果显示,SMT制程工艺并不影响焊接界面金属间化合物层的组成,IMCs主要成分为Cu6Sn5 相,但影响了IMCs层的形态与厚度,其中传送带速度影响了Cu6Sn5 相的平均直径,而恒温区保温时间则对IMCs层的形态与厚度影响最大。
【Abstract】 The effects of the surface mount technology (SMT) processing technology, including the solder paste viscosity,stencil thickness,conveyer speed,isothermal time,PCB roasting treatment,on the interface between Sn-37Pb solder and Cu pad of PCB were investigated with scanning electron microscope (SEM).The results show that SMT processing technology did not affect the Cu6Sn5 phase in intermetallic compounds (IMCs) layer between Sn-37Pb solder and Cu pad.However, the shape and thickness of IMC layer were changed by SMT processing technology,especially the conveyer speed and isothermal time.
【Key words】 Surface mount technology; Process technology; Soldering interface; Intermetallic compounds layer;
- 【文献出处】 电子工艺技术 ,Electronics Process Technology , 编辑部邮箱 ,2005年02期
- 【分类号】TN405
- 【被引频次】5
- 【下载频次】170