【摘要】 微电铸是相对于常规电铸工艺而确立的新概念,它是适用于微小结构成型而建立的批量加工技术,既可以看作是在微细加工模具基础上的传统电铸技术的延伸,也可以认为是掩膜电镀在高深宽比方向发展的结果,微电铸工艺是LIGA/准LIGA技术的核心内容,在MEMS技术领域有广泛应用。介绍了电铸和微电铸的原理和特点,系统分析了微电铸过程的电化学本质,综述了微电铸技术研究的最新进展,给出了一些为大家所共识的微电铸镍基本工艺规范。更多还原

【Abstract】 Microelectroforming is a novel conception relatively being contrast to conventional electroforming process.It is established to be a batch machining process for microstructures moulding.It can be seen both as the extension of conventional electroforming process based on the micromachined mould and as the development result of the electroplating through high aspect ratio mask. Being the key of LIGA /quasi-LIGA technology,microelectroforming process has wide applications in all kinds of MEMS fields.Present the principles and characteristics of electroforming and microelectrofoming,and also analyse the electrochemical essence of microelectroforming process systematically.The newest development of microelectroforming process is reviewed to provide some basic process criteria of nickel microelectroforming.更多还原