【摘要】 介绍了非导体表面金属化技术。阐述了化学镀、直接电镀技术Futuron工艺、化学还原、接枝共聚表面处理新技术,并分析了近年来在非导体金属化方面关键技术的改进和发展;介绍了非导体金属化技术的应用领域,并对金属化技术的应用前景进行了探讨。更多还原

【Abstract】 The techniques of surface metallization of nonconductors, including electroless plating, direct electroplating, chemical reduction, graft co-polymerization, etc. are introduced. The improvement and development of key techniques in these fields are analyzed. The application prospects of these techniques are discussed.更多还原