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硫代硫酸盐无氰脉冲镀银工艺研究

Study on the Thiosulfate Cyanide-free Silver Pulse Plating Process

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【作者】 苏永堂成旦红李科军曹铁华徐伟一

【Author】 SU Yong-tang~1, CHENG Dan-hong~1, LI Ke-jun~2, CAO Tie-hua~2, XU Wei-yi~2 (1. Depart. of Chem., College of Sciences, Shanghai Univ., Shanghai 200436, China; 2. School of Environmental and Chemical Engineering, Shanghai Univ., Shanghai 200072, China)

【机构】 上海大学理学院化学系上海大学环境与化学工程学院上海大学环境与化学工程学院 上海 200436上海 200436上海 200072上海 200072

【摘要】 对无氰镀银工艺进行了优选,找到一种无氰光亮镀银添加剂的配方,并对其工艺参数进行优选,得出最佳脉冲参数为:脉宽1ms,占空比为10%,电流密度为0.6A/dm2。在最佳工艺参数下得到的银镀层镜面光亮,与直流镀银相比,抗变色性和耐蚀性均显著提高,并通过扫描电镜观察了镀层的表面形貌。

【Abstract】 Cyanide-free silver plating processes were optimized. A mirror-like bright additive for the cyanide-free bright silver plating process was found out. The optimum pulse parameters of pulse electrodeposition of bright silver were optimized, and 1 millisecond pulse width, 10% positive duty cycle and 0.6 A/dm~2 average cathodic current densities were obtained. The anti-tarish property and the corrosion resistance of silver coating with pulse plating were higher than those with DC plating. The appearnace morphology of the silver coatings were analyzed by SEM.

  • 【文献出处】 电镀与精饰 ,Plating and Finishing , 编辑部邮箱 ,2005年02期
  • 【分类号】TQ153.1
  • 【被引频次】23
  • 【下载频次】440
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