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镁合金基体上镍磷镀层的退除

Stripping of Ni-P coating on Mg alloy substrate

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【作者】 彭金云周建芳邹惠民林伯成

【Author】 PENG Jin-yun, ZHOU Jian-fang, ZOU Hui-min, LIN Bo-chengDept. of Material and Chemical Engineering, Guilin University of Technology, Guilin, Guangxi 541004, China

【机构】 桂林工学院材料与化学工程系衡阳无线电总厂衡阳无线电总厂 桂林541004桂林541004衡阳421001衡阳421001

【摘要】 提出了一种采用HF与HNO3退除镁合金上化学镀镍磷镀层的方法。测试了不同HF与HNO3组合的退镀液的性能,并分别测定了不同HF与HNO3含量对退镀效果的影响。结果表明,退镀液中含有一定含量的F-,可保护基体不受腐蚀,其生成的保护膜主要为MgF2。当退镀液中w(HF)∶w(HNO3)∶w(H2O)为4∶3∶3时,效果最好。由于HF有剧毒,因此操作过程应采取相应的防护措施。

【Abstract】 A method using HF and HNO3 to strip electroless Ni-P coating on Mg alloy substrate was proposed. The performance of stripping solution with different content of HF and HNO3 and the influence of different content of HF and HNO3 on stripping effect were tested respectively. The results prove that a quantity of F- in stripping solution can protect the substrate from corrosion by forming protective film which mainly is MgF2. When (w(HF)∶)w(HNO3)∶w(H2O) is 4∶3∶3, the stripping solution has best stripping effect. Because HF has severe toxicity, protective measures must be taken during operation.

  • 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2005年07期
  • 【分类号】TQ153
  • 【被引频次】4
  • 【下载频次】209
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