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磁控溅射镀钽及其镀层性能的研究

Study of tantalum plating by magnetron sputtering and it’s coating characteristic

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【作者】 单玉桥于晓中李力田晓飞

【Author】 SHAN Yu-qiao, YU Xiao-zhong, LI Li, TIAN Xiao-fei (School of Material & Metallurgy, Northeastern University, Shenyang 110004, China)

【机构】 沈阳东北大学材料与冶金学院沈阳东北大学材料与冶金学院 沈阳 110004沈阳 110004沈阳 110004

【摘要】 利用直流磁控溅射法,在铝基片、玻璃基片上制备了钽膜。研究了氩气压力、阴极电流、系统本底真空度、溅射时间等工艺条件对钽膜性能及厚度的影响,并对钽膜的物理性能及电学性能进行了研究。结果表明,钽镀层的厚度主要与钽靶功率、氩气分压及溅射时间有关;当氩气压力、电流一定时,钽镀层的厚度与溅射时间近似地成正比关系。利用3A/(8min)、4A/(6min)、5A/(3min)各5片铝基片镀钽的样品制成了医用CT检测器信号接受盒,获得的X ray电信号分别为30万、32万、34万单位,达到并超过了国际同类产品的技术指标。

【Abstract】 <Abstrcat> Tantalum films were deposited on aluminum and glass substrates by D.C. magnetron sputtering. The influence of process conditions on tantalum films properties and thickness, including Ar pressure, cathode current, base pressure of chamber, sputtering time, and so on, were researched. The physical and electrical properties of tantalum film were also studied. The results show that the thickness of tantalum film is mainly related to the power of tantalum target, the partial pressure of Ar gas and the sputtering time, and the thickness of tantalum films is approximately directly proportional to the sputtering time with Ar gas pressure and current density being fixed. Five tantalum plating samples obtained on aluminum substrates with 3 A/(8 min), 4 A/(6 min), 5 A/(3 min) were used to make the receiving box for medical CT, and the electrical signals of X-ray acquired were 300 thousand, 320 thousand and 340 thousand unit respectively, reaching and exceeding the international technical standard of the same type of products.

  • 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2005年06期
  • 【分类号】TQ153.1
  • 【被引频次】12
  • 【下载频次】470
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