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铝合金化学镀Ni-P-B的研究
Study of electroless Ni-P-B plating on aluminium alloys
【摘要】 以二甲基胺硼烷(DMAB)为还原剂,在铝合金上获得了化学镀镍低磷低硼镀层,研究了硫酸镍、次磷酸钠、 DMAB、络合剂、pH值和稳定剂对镀层的沉积速度、显微硬度和微观形貌的影响。通过正交实验和单因素实验,确定了最 佳工艺配方为:24 g/L硫酸镍,适量DMAB,12 g/L次磷酸钠,3 mg/L硫脲,30 mL/L络合剂。所获得的化学镀镍镀层中 P、B、Ni的质量分数分别为:1.81%、0.26%和97.93%。该镀层与基体的结合力良好,硬度在550~710HV范围内,在铝 质活塞上应用获得了满意的效果。
【Abstract】 A kind of electroless nickel plating deposits with low content of phosphor and boron on aluminium alloys were obtained with boron dimethylamine complex (DMAB) as reducer. The influences of nickel sulfate, sodium hypophosphite, DMAB, complexant, pH value and stabilizer on deposition rate, micro - hardness and micro - structure were studied . The formula was optimized by orthogonal test and single factor test as follows : 24 g/L nickel sulphate, 12 g/L sodium hypophosphite , suitable addition amount of DMAB, 3 mg/L thiourea , 30 mg/L complextant. The weight percent of P, B, Ni in the deposits were 1.81 % , 0.26 % and 97.93% respectively. The deposits have good adhesion to substrate and its micro-hardness is between 550 HV to 710 HV .The deposits have been successfully applied to aluminium piston.
【Key words】 aluminium alloy; electroless Ni-P-B plating; boron dimethylamine complex (DMAB); orthogonal test;
- 【文献出处】 电镀与涂饰 ,Electroplating & Finishing , 编辑部邮箱 ,2005年02期
- 【分类号】TQ153
- 【被引频次】9
- 【下载频次】338