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软熔处理对锡镀层的影响
Effects of Mild Melt Treatment on Tin Coatings
【摘要】 研究了软熔处理温度与保温时间对锡镀层的镀层结合力、镀层表面形貌和孔隙率的影响。结果表明:软熔处理会改善镀层结合力,但温度和时间不宜过高、过长;软熔处理的温度过高和时间过长,表面会析出锡珠,影响表面质量;软熔处理会降低镀层的孔隙率,但温度高于200°C,则孔隙率会随着温度的升高而增加。
【Abstract】 The effects of temperature and retaining time in mild melt treatment on the bonding strength, surface morphology and porosity of tin coating are studied. The results show that mild melt treatment can improve the bonding strength of coating, but too high temperature and too long retaining time is not suitable; higher temperature and longer time will result in tin beads separated out from coating surface, affecting surface quality; melt treatment can reduce the porosity of tin coating, but over (200 °C,) the porosity will increase with the rising of temperature.
【关键词】 电镀;
锡镀层;
软熔处理;
镀层结合力;
孔隙率;
【Key words】 electroplating; tin coating; mild melt treatment; bonding strength; porosity;
【Key words】 electroplating; tin coating; mild melt treatment; bonding strength; porosity;
【基金】 国家自然科学基金“铝铅非混溶系组织结构及性能研究”(项目编号:50064)
- 【文献出处】 电镀与环保 ,Electroplating & Pollution Control , 编辑部邮箱 ,2005年04期
- 【分类号】TQ153
- 【被引频次】14
- 【下载频次】172