【摘要】 运用弥散强化原理,分别选用Ag颗粒和Ni颗粒作为增强体,以63Sn37Pb共晶钎料为基体,制成金属颗粒增强锡铅基复合钎料。在再流焊条件下,弥散分布的增强体与基体冶金结合,在增强体表层形成一薄层金属间化合物,从而使复合钎料蠕变性能大幅度提高。试验证明:在相同条件下,与基体钎料63Sn37Pb相比,5%Ag(体积分数,下同)和10%Ag颗粒增强锡铅基复合钎料蠕变寿命分别提高了8倍和6倍,同时抗拉强度和剪切强度均得到提高;5%Ni和10%Ni颗粒增强锡铅基复合钎料蠕变寿命分别提高了84倍和185倍,但剪切强度和延伸率均明显降低。更多还原

【Abstract】 Fine particles of Ag and Ni with size of about 1 μm are added in the eutectic 63Sn-37Pb solder to form metal particles enhanced SnPb based composite solders. Under re-flow soldering, the enhanced particles are uniformly dispersed in the 63Sn37Pb alloy, and intermetallic compounds with very thin layer formed between the enhanced particles and matrix. Tightly metallurgical coalescence is thus realized. At ambient temperature, the creep rupture lifetime of 5vol% Ag and 10vol% Ag particles enhanced SnPb based composite solder joints can be increased by 8 times and 6 times respectively compared to that of the ordinary 63Sn-37Pb eutectic solder. At the same time, the tensile strength and tensile-shear strength of Ag particles enhanced composite solders were higher, yet elongation was lower than that of 63Sn37Pb solder. Under the same condition, the rupture lifetime of Ni particles enhanced composite solders are also improved evidently. Lifetime of 5vol% Ni and 10vol% Ni particles enhanced SnPb based composite solder joints can be increased by 84 times and 185 times respectively compared to that of the ordinary 63Sn-37Pb solder. However, the tensile-shear strength and elongation of Ni particles enhanced composite solders were lower than those of 63Sn37Pb eutectic solder.更多还原