【摘要】 采用D1P和D1F两种中间层合金在1250℃下分别保温10,30min,1,2,4h扩散连接DD3单晶合金。这两种中间层合金是在DD3合金成分基础上添加了一定量的降熔元素硼,分别以粉和箔带形式使用。对上述规范下获得的DD3接头组织和性能进行了研究分析,结果表明,扩散时间短,D1P中间层合金扩散焊接头组织很不均匀,在中间层合金流入处生成大量光板γ′相,对接头持久性能不利,1250℃下扩散4h接头的980℃持久性能为母材性能的60%;而D1F中间层合金扩散焊接头组织均匀一致,1250℃下扩散4h接头980℃持久性能超过母材性能的70%。更多还原

【Abstract】 Single crystal superalloy DD3 was diffusion bonded at 1250℃ for 10,30min,1,2,4h with two interlayer alloys D1P and D1F.The compositions of these two interlayer alloys are similar to those of DD3 substrate and boron was added as melting-point depressant.The microstructures and mechanical properties of the joints were examined.Results showed that holding for such short time,there were a lot of blocky γ′phases in the bonding seam with D1P interlayer alloy,causing a lower stress rupture property of about 60% of the DD3 substrate at 980℃.However,for the D1F interlayer alloy, homogenious joint microstructures were obtained showing a higher stress rupture property of about 70% of the DD3 substrate at 980℃.更多还原