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倍半硅氧烷改性E-51/DDS树脂体系的性能研究

Study on E-51/DDS System Modified by Silsesquioxane Based on (3-glycidoxypropyl) Trimethoxysilane

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【作者】 刘海林马晓燕梁国正卢婷莉葛强

【Author】 LIU Hai-lin, MA Xiao-yan, LIANG Guo-zheng, LU Ting-li, GE Qiang (Northwestern Polytechnical University, Xi′an 710072, China)

【机构】 西北工业大学西北工业大学 西安 71 0 0 72西安 71 0 0 72西安 71 0 0 72

【摘要】 用自制的γ-(2,3-环氧丙氧)丙基倍半硅氧烷为改性剂,对双酚A缩水甘油醚型环氧树脂E-51进行改性,两者配比为60/40(质量比),选用等当量的4,4′-二氨基二苯砜(DDS)为固化剂,形成环氧-倍半硅氧烷杂化材料。通过凝胶特性曲线、傅立叶变换红外光谱(FTIR)以及差示扫描量热方法(DSC)研究了该体系的固化反应特性及动力学问题;初步研究了固化体系的力学性能以及热性能。结果表明,该体系具有较好的工艺性,其固化反应的活化能是48.7kJ/mol,体系的热变形温度(HDT)达到200℃,热分解温度达到442℃,玻璃化转变温度(Tg)达到245℃,比相同条件下的E-51/DDS体系分别高出了31,58,20℃,体系在800℃时热残余量为25%,同时其弯曲强度和冲击强度基本保持不变。

【Abstract】 The E-51 epoxy resin modified by adding 3-glycidoxypropyl polyhedral silsesquioxane cage and using equivalent 4,4′-diaminodiphenyl sulfone (DDS) as the curing agent were studied. The FTIR spectrum, gelation characteristics and differential scanning calorimetry (DSC) were used to study the curing behavior and kinetics of the composites.The mechanical properties of the systems were also considered. The results showed that the cured reaction had lower activation energy E_a =48.7kJ/mol. The heat deformation temperature (HDT), thermal decomposition temperature and glass transition temperature (T_g) of the composite were 200℃, 442℃ and 245℃, and were 31℃, 58℃ and 20℃ respectively higher than that of E-51/DDS system under the same curing condition. This composite had higher thermal residue, which can be as high as 25% at 800℃. The flexural and impact strength were basically unchanged at the same time.

【关键词】 环氧倍半硅氧烷固化
【Key words】 epoxysilsesquioxanecure
  • 【文献出处】 材料工程 ,Journal of Materials Engineering , 编辑部邮箱 ,2005年04期
  • 【分类号】TB332
  • 【被引频次】11
  • 【下载频次】348
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