【摘要】 利用有限元模拟方法,对一种压阻式高量程MEMS加速度计进行了10万g峰值的半正弦加速度脉冲下的响应分析.灌封胶弹性模量的变化对高量程加速度计输出电压信号的影响可以忽略,且模拟输出电压的峰值与解析解接近.应力分析表明,芯片粘结胶、芯片与芯片盖板之间封接胶环的等效应力均随灌封胶弹性模量的增加而减小;弹性模量在4GPa以上的灌封胶适宜用来保护芯片.动态有限元模拟结果与自由落杆测试结果接近.更多还原

【Abstract】 The dynamic response of the package structure of a piezoresistive high-g MEMS accelerometer under a half sine pulse of acceleration with 100,000 g’s peak is simulated using the finite element method.Results show that the effect of the modulus of encapsulant on the simulated output voltage can be ignored.The peak value of output voltage is close to the analytic solution.Stress analysis show that the maximum equivalent stress in the die-attach adhesive and sealing ring decreases with the increase in elastic modulus of encapsulant.The encapsulant with elastic modulus above 4GPa is also suitable for encapsulation.The simulated output voltage is close to the drop test result.更多还原