【摘要】 用基于改进的RCA清洗液结合兆声清洗法和离心喷射法清洗抛光的硅片 ,干燥后用激光扫描法测试抛光硅片表面颗粒 .结果表明 ,改进的RCA清洗液结合兆声的清洗方法对于去除硅片表面的微小颗粒具有更高的效率 .更多还原

【Abstract】 This paper analyses and compares the mechanism for the removal of submicron particles from the silicon wafer surface by spinning spray and megasonics cleaning method.The experiments prove that the modified RCA associated with megasonics cleaning method can achieve a higher rate of submicron particle removal.更多还原