【摘要】 针对常压和真空两种环境 ,通过三维有限元模拟分析了背面体硅加工型、正面体硅加工型和表面加工型三种微热板 (MHP)的传热主渠道和加热功率 .制作了背面体硅加工型和表面加工型MHP ,并对两者在常压及 13 3Pa气压下的加热功率进行了测试 .实验值与有限元分析结果一致 ,表明虽然真空中表面加工型MHP热功耗小于背面体硅加工型MHP ,但薄层空气导热使表面加工型MHP在大气中的功耗大幅增加 ,并大于背面体硅加工型MHP的热功耗更多还原

【Abstract】 Thermal simulation of three types of MHPs (surface micro-machined,back-side bulk silicon micro-machined,and front-side bulk silicon micro-machined) working in atmosphere and vacuum is performed with 3D FEA.Their first two types of MHPs are fabricated and their experimental results are in agreement with the FEA.It is shown that,power consumption of the surface micromachined MHP is smaller than the back-side bulk silicon micromachined MHP in vacuum;however,in atmosphere,thermal conduction of the thin air layer in the surface micro-machined MHP dramatically increases its power consumption,with is much larger than that of the back-side bulk silicon micromachined MHP.更多还原